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IEEE
IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2020;28;3;10.1109/TVLSI.2019.2954770
Energy-delay-product (EDP)
monolithic 3-D (M3D)
network-on-chip (NoC)
performance
process variation
Inter-Tier Process-Variation-Aware Monolithic 3-D NoC Design Space Exploration
Shouvik Musavvir
Anwesha Chatterjee
Ryan Gary Kim
Dae Hyun Kim
Partha Pratim Pande
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