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liang-yu chen, Robert Okojie, Philip Neudeck, Gary Hunter, Shun-Tien Lin
Packaging of High Temperature SiC Based Electronics
SiC Based Electronics
Packaging
High Temperature
SiC
Electronics
AIN
FEA
IEEE Links
2001-07-31T17:08:47Z
Microsoft Word 8.0
2011-07-05T10:01:20-04:00
2011-07-05T10:01:20-04:00
Acrobat Distiller 4.05 for Windows
Packaging, High Temperature, SiC, Electronics, AIN, FEA, IEEE Links
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